The kinetics of formation of ternary intermetallic alloys in Pb-Sn and Cu-Ag-Sn Pb-free electronic joints

Author

Zribi, A. ; Zavalij, L. ; Borgesen, P. ; Primavera, A. ; Westby, G. ; Cotts, E.J.

Author_Institution

Dept. of Phys., State Univ. of New York, Binghamton, NY, USA

fYear

2001

fDate

2001

Firstpage

687

Lastpage

692

Abstract

A simple model of the formation of Au_0.1Ni_0.1Sn_0.8 in Pb-Sn solder/Ni interconnects is examined by numerical simulation. Previous experimental observation has shown that after reflow the interface consists of the Ni ₃Sn₄ alloy between Pb-Sn solder and Ni, with Au distributed through the PbSn solder ball. Au_0.1Ni_0.1Sn_0.8 was observed to form at the Pb-Sn solder/Ni₃Sn₄ interface during annealing at 150°C in a number of studies. The numerical simulation was used to calculate the maximum flux of Au to the interface, and with the assumption that this Au was immediately incorporated in to Au_0.1Ni_0.1Sn_0.8 a maximum rate of formation of Au_0.1Ni_0.1Sn_0.8 was calculated. This rate was found to be similar to measured rates of formation of Au_0.1Ni_0.1Sn_0.8 from two different studies. The formation of(CuNi)6SnS in Sn-Ag-Cu/Ni solder interconnects was discussed within the context of these observations

Keywords

annealing; integrated circuit packaging; integrated circuit reliability; reflow soldering; 150 degC; CuAgSn; PbSn; annealing; lead-free electronic joints; maximum flux; numerical simulation; reflow; solder interconnects; ternary intermetallic alloys; Gold alloys; Intermetallic; Kinetic theory; Metallization; Nickel alloys; Numerical simulation; Oxidation; Soldering; Temperature; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2001. Proceedings., 51st

Conference_Location

Orlando, FL

ISSN

0569-5503

Print_ISBN

0-7803-7038-4

Type

conf

DOI

10.1109/ECTC.2001.927807

Filename

927807