DocumentCode
3165958
Title
Localized plasma processing of materials using atmospheric pressure microplasma jets
Author
Yoshiki, H. ; Horiike, Y.
Author_Institution
Dept. of Electr. Eng., Tsuruoka Nat. Coll. of Technol., Japan
fYear
2002
fDate
6-8 Nov. 2002
Firstpage
236
Lastpage
237
Abstract
In this paper, an atmospheric-pressure microplasma jet driven by RF corona discharge is reported. The localized Si etching by the microplasma jet with the mixture of He/SF/sub 6/ gases is demonstrated.
Keywords
corona; elemental semiconductors; plasma jets; silicon; sputter etching; He/SF/sub 6/ gas mixture; RF corona discharge; Si; atmospheric pressure microplasma jet; localized etching; plasma processing; Atmospheric-pressure plasmas; Etching; Fluid flow; Gases; Helium; Needles; Plasma applications; Plasma materials processing; Radio frequency; Steel;
fLanguage
English
Publisher
ieee
Conference_Titel
Microprocesses and Nanotechnology Conference, 2002. Digest of Papers. Microprocesses and Nanotechnology 2002. 2002 International
Conference_Location
Tokyo, Japan
Print_ISBN
4-89114-031-3
Type
conf
DOI
10.1109/IMNC.2002.1178631
Filename
1178631
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