Triple-mode Five-band Power Amplifier LTCC Module for WLAN/GPRS/WCDMA Applications

Author

Lai, Chung-Chi ; Hsu, Yu-Cheng ; Chen, Cheng-Chung

Author_Institution

Dept. of RF Commun. Syst. Technol., Inf. & Commun. Res. Labs., Hsinchu

fYear

2006

fDate

10-15 Sept. 2006

Firstpage

1486

Lastpage

1489

Abstract

A compact power amplifier module (PAM) integrated with a power detector utilizing low temperature co-fired ceramic (LTCC) technology is presented for the IEEE 802.11a/b/g, GPRS and WCDMA applications. All MMICs´ matching circuits were fabricated with the input and inter-stage matching circuits realized on-chip so that the PAM size is significantly reduced. The output matching circuit was implemented on an LTCC substrate to reduce power loss based on the advantages of high-Q ceramic components. The proposed PAM provides high power added efficiency and good linearity. Moreover, the measured results indicate the excellent performance of this PAM

Keywords

IEEE standards; MMIC; code division multiple access; multichip modules; packet radio networks; power amplifiers; wireless LAN; IEEE 802.11a/b/g; LTCC substrate; MMIC matching circuits; WLAN/GPRS/WCDMA; high-Q ceramic components; low temperature co-fired ceramic; power amplifier LTCC module; power amplifier module; power detector; Ceramics; Detectors; Ground penetrating radar; Impedance matching; Integrated circuit technology; MMICs; Multiaccess communication; Power amplifiers; Temperature; Wireless LAN; GaAs MMIC; LTCC substrate; Power amplifiers; power amplifier module;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Conference, 2006. 36th European

Conference_Location

Manchester

Print_ISBN

2-9600551-6-0

Type

conf

DOI

10.1109/EUMC.2006.281340

Filename

4058120