• DocumentCode
    3172856
  • Title

    Temperature-aware cooperative ring oscillator PUF

  • Author

    Qu, Gang ; Yin, Chi-En

  • Author_Institution
    Electr. & Comput. Eng. Dept., Univ. of Maryland, College Park, MD, USA
  • fYear
    2009
  • fDate
    27-27 July 2009
  • Firstpage
    36
  • Lastpage
    42
  • Abstract
    Physical unclonable functions leverage the manufacture variations during silicon fabrication process and have found many security related applications. The ring oscillator PUF relies on pairs of ring oscillators which have sufficiently large difference in delay to generate reliable bits. Current RO PUF approaches use redundancy to provide reliability under different operating temperature and thus have very high hardware cost.We propose a temperature-aware cooperative (TAC) RO PUF implementation to reduce such cost. The basic idea is to allow a pair of ring oscillators to generate an unreliable bit as long as we can find means to convert it to a reliable bit. We define bit generation rules that explicitly take temperature into consideration and pair up the ring oscillator pairs so they can cooperate. Experiments on FPGA show that our approach can significantly improve the efficiency of the RO PUF implementation. With the same hardware that the current state-of-art approach requires to generate one reliable bit, our TAC RO PUF approach can generate as high as 1.8 reliable bits, that is, an 80% improvement in hardware utilization.
  • Keywords
    field programmable gate arrays; oscillators; FPGA; physical unclonable functions; silicon fabrication; temperature-aware cooperative ring oscillator; Costs; Delay; Fabrication; Hardware; Manufacturing processes; Redundancy; Ring oscillators; Security; Silicon; Temperature; Physical Unclonable Function (PUF); chip identification; cooperation; generation; on-chip temperature awareness; ring oscillator; secret-key storage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Hardware-Oriented Security and Trust, 2009. HOST '09. IEEE International Workshop on
  • Conference_Location
    Francisco, CA
  • Print_ISBN
    978-1-4244-4805-0
  • Electronic_ISBN
    978-1-4244-4804-3
  • Type

    conf

  • DOI
    10.1109/HST.2009.5225055
  • Filename
    5225055