DocumentCode
3173389
Title
Effect of post deposition annealing temperature on the properties of ZnO films prepared by RF magnetron sputtering
Author
Arora, Abhishek ; Arora, Abhishek ; Dwivedi, V.K. ; George, P.J. ; Gupta, V.
Author_Institution
MEMS & Micro sensors Group, Pilani
fYear
2007
fDate
16-20 Dec. 2007
Firstpage
500
Lastpage
503
Abstract
Highly C-axis oriented ZnO films were deposited by RF magnetron sputtering technique on unheated Si substrate with SiO2 layer deposited using thermal oxidation. We employ thermal annealing techniques with temperature range from 350degC to 800degC to investigate quality of annealed ZnO substrates. Post deposition annealing of ZnO films at atmospheric pressure in oxygen at different temperatures were found to improve film structure such as dense structure, smooth surface, and increasing resistivity. The surface morphology dramatically changes to be smooth surfaces with increase in annealing temperature. The correlation between annealing conditions and the physical structure of the films e.g. crystalline structure and microstructure was investigated by X-ray diffraction (XRD) and atomic force microscopy (AFM). The preferred annealing condition has been found to improve ZnO film characteristics for piezoelectric applications.
Keywords
annealing; oxidation; sputtering; RF magnetron sputtering; Si substrate; X-ray diffraction; ZnO; ZnO films; atmospheric pressure; atomic force microscopy; film structure; oxygen; post deposition annealing temperature; surface morphology; temperature 350 C to 800 C; thermal annealing; thermal oxidation; Annealing; Atomic force microscopy; Magnetic properties; Piezoelectric films; Radio frequency; Sputtering; Substrates; Surface morphology; Temperature; Zinc oxide; Annealing; RF Sputtering; Surface morphology; ZnO films; microstructure;
fLanguage
English
Publisher
ieee
Conference_Titel
Physics of Semiconductor Devices, 2007. IWPSD 2007. International Workshop on
Conference_Location
Mumbai
Print_ISBN
978-1-4244-1728-5
Electronic_ISBN
978-1-4244-1728-5
Type
conf
DOI
10.1109/IWPSD.2007.4472559
Filename
4472559
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