• DocumentCode
    3174550
  • Title

    Optimising Heterogeneous 3D Networks-on-Chip

  • Author

    Agyeman, Michael Opoku ; Ahmadinia, Ali

  • Author_Institution
    Sch. of Eng. & Comput., Glasgow Caledonian Univ., Glasgow, UK
  • fYear
    2011
  • fDate
    3-7 April 2011
  • Firstpage
    25
  • Lastpage
    30
  • Abstract
    The emergence of the third dimension in Network-on-Chip (NoC) design as a quest to improve the quality of service (QoS) of on-chip communication has evolved with enormous interest. However the underlying router architecture of 3D NoCs have more area footprint than 2D routers. In this paper, we investigate heterogeneous 3D NoC topologies with the focus on finding a balance between the manufacturing cost and the QoS by employing the area and performance benefits provided by 2D routers and 3D NoC-bus hybrid router architectures in 3D mesh topology. Experimental results show a negligible penalty in throughput of 3D mesh with homogeneous distribution of 3D NoC-bus hybrid routers. The heterogeneity however provides superiority in area efficiency of the NoC resources.
  • Keywords
    integrated circuit design; network routing; network topology; network-on-chip; system buses; three-dimensional integrated circuits; 2D router; 3D NoC-bus hybrid router architecture; 3D mesh topology; NoC design; NoC resource; heterogeneous 3D NoC topology; heterogeneous 3D networks-on-chip; manufacturing cost; on-chip communication; quality of service; Computer architecture; Integrated circuit interconnections; Network topology; System-on-a-chip; Three dimensional displays; Throughput; Topology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Parallel Computing in Electrical Engineering (PARELEC), 2011 6th International Symposium on
  • Conference_Location
    Luton
  • Print_ISBN
    978-1-4577-0078-1
  • Electronic_ISBN
    978-0-7695-4397-0
  • Type

    conf

  • DOI
    10.1109/PARELEC.2011.40
  • Filename
    5770396