DocumentCode
3174550
Title
Optimising Heterogeneous 3D Networks-on-Chip
Author
Agyeman, Michael Opoku ; Ahmadinia, Ali
Author_Institution
Sch. of Eng. & Comput., Glasgow Caledonian Univ., Glasgow, UK
fYear
2011
fDate
3-7 April 2011
Firstpage
25
Lastpage
30
Abstract
The emergence of the third dimension in Network-on-Chip (NoC) design as a quest to improve the quality of service (QoS) of on-chip communication has evolved with enormous interest. However the underlying router architecture of 3D NoCs have more area footprint than 2D routers. In this paper, we investigate heterogeneous 3D NoC topologies with the focus on finding a balance between the manufacturing cost and the QoS by employing the area and performance benefits provided by 2D routers and 3D NoC-bus hybrid router architectures in 3D mesh topology. Experimental results show a negligible penalty in throughput of 3D mesh with homogeneous distribution of 3D NoC-bus hybrid routers. The heterogeneity however provides superiority in area efficiency of the NoC resources.
Keywords
integrated circuit design; network routing; network topology; network-on-chip; system buses; three-dimensional integrated circuits; 2D router; 3D NoC-bus hybrid router architecture; 3D mesh topology; NoC design; NoC resource; heterogeneous 3D NoC topology; heterogeneous 3D networks-on-chip; manufacturing cost; on-chip communication; quality of service; Computer architecture; Integrated circuit interconnections; Network topology; System-on-a-chip; Three dimensional displays; Throughput; Topology;
fLanguage
English
Publisher
ieee
Conference_Titel
Parallel Computing in Electrical Engineering (PARELEC), 2011 6th International Symposium on
Conference_Location
Luton
Print_ISBN
978-1-4577-0078-1
Electronic_ISBN
978-0-7695-4397-0
Type
conf
DOI
10.1109/PARELEC.2011.40
Filename
5770396
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