DocumentCode
3174626
Title
Plasma-etched nanofiber anisotropic conductive films (ACFs) for ultra fine pitch interconnection
Author
Sang Hoon Lee ; Tae Wan Kim ; Kyung-Wook Paik
Author_Institution
Dept. of Mater. Sci. & Eng., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea
fYear
2015
fDate
26-29 May 2015
Firstpage
142
Lastpage
145
Abstract
Plasma etched nanofiber ACFs were investigated in terms of conductive particle movement and electrical contact properties. For the plasma etched nanofiber ACFs, polyvinylidene fluoride (PVDF) was used as a nanofiber material. Conductive particles were incorporated into nanofibers by an electrospinning method and heat treated nanofiber was plasma etched using O2 plasma to remove insulating polymer layer coated on conductive particles for nanofiber ACF bonding. Plasma etched conductive particle incorporated nanofiber successfully suppressed the free movement of conductive particles during the ACF bonding process and increased the percentage of captured particles after bonding from 35% up to 80% resulting in excellent electrical contact properties.
Keywords
bonding processes; electrical contacts; electrospinning; fine-pitch technology; heat treatment; interconnections; nanofibres; oxygen; polymer films; sputter etching; O2; PVDF; electrical contact property; electrospinning method; heat treated nanofiber; insulating polymer layer coating; nanofiber ACF bonding process; oxygen plasma; plasma etched conductive particle; plasma-etched nanofiber anisotropic conductive film; polyvinylidene fluoride; ultra fine pitch interconnection; Bonding; Contacts; Electrodes; Plasma properties; Polymers;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th
Conference_Location
San Diego, CA
Type
conf
DOI
10.1109/ECTC.2015.7159583
Filename
7159583
Link To Document