• DocumentCode
    3174626
  • Title

    Plasma-etched nanofiber anisotropic conductive films (ACFs) for ultra fine pitch interconnection

  • Author

    Sang Hoon Lee ; Tae Wan Kim ; Kyung-Wook Paik

  • Author_Institution
    Dept. of Mater. Sci. & Eng., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea
  • fYear
    2015
  • fDate
    26-29 May 2015
  • Firstpage
    142
  • Lastpage
    145
  • Abstract
    Plasma etched nanofiber ACFs were investigated in terms of conductive particle movement and electrical contact properties. For the plasma etched nanofiber ACFs, polyvinylidene fluoride (PVDF) was used as a nanofiber material. Conductive particles were incorporated into nanofibers by an electrospinning method and heat treated nanofiber was plasma etched using O2 plasma to remove insulating polymer layer coated on conductive particles for nanofiber ACF bonding. Plasma etched conductive particle incorporated nanofiber successfully suppressed the free movement of conductive particles during the ACF bonding process and increased the percentage of captured particles after bonding from 35% up to 80% resulting in excellent electrical contact properties.
  • Keywords
    bonding processes; electrical contacts; electrospinning; fine-pitch technology; heat treatment; interconnections; nanofibres; oxygen; polymer films; sputter etching; O2; PVDF; electrical contact property; electrospinning method; heat treated nanofiber; insulating polymer layer coating; nanofiber ACF bonding process; oxygen plasma; plasma etched conductive particle; plasma-etched nanofiber anisotropic conductive film; polyvinylidene fluoride; ultra fine pitch interconnection; Bonding; Contacts; Electrodes; Plasma properties; Polymers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th
  • Conference_Location
    San Diego, CA
  • Type

    conf

  • DOI
    10.1109/ECTC.2015.7159583
  • Filename
    7159583