DocumentCode
3175612
Title
Stacked devices for SEU immune design
Author
Oldiges, P. ; Rodbell, K. ; Ning, T. ; Cai, J. ; Heidel, D. ; Tang, H. ; Wissel, L. ; Gordon, M.
Author_Institution
Semicond. R&D Center, IBM Corp., Hopewell Junction, NY, USA
fYear
2010
fDate
11-14 Oct. 2010
Firstpage
1
Lastpage
2
Abstract
A stacked transistor on SOI shows the potential to provide soft error upset immune designs. Key design elements are presented and analyzed showing tradeoffs between standard SOI devices and stacked devices, as well as alternative layouts to optimize soft error upset immunity.
Keywords
MOSFET; silicon-on-insulator; SEU immune design; SOI devices; alternative layouts; key design elements; soft error upset immune designs; soft error upset immunity; stacked devices; stacked transistor; Electric potential; Immune system; Junctions; Logic gates; MOSFET circuits; Single event upset; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
SOI Conference (SOI), 2010 IEEE International
Conference_Location
San Diego, CA
ISSN
1078-621x
Print_ISBN
978-1-4244-9130-8
Electronic_ISBN
1078-621x
Type
conf
DOI
10.1109/SOI.2010.5641469
Filename
5641469
Link To Document