Hybrid integration and packaging of an energy-efficient WDM silicon photonic chip-to-chip interconnect

Author

Thacker, Hiren D. ; Shafiiha, Roshanak ; Lexau, Jon ; Xuezhe Zheng ; Djordjevic, Stevan S. ; Shiyun Lin ; Simons, John ; Abed, Arin ; Amberg, Phil ; Chang, Eric ; Shubin, Ivan ; Jin-Hyoung Lee ; Ying Luo ; Jin Yao ; Liu, Frankie ; Hong Liang ; Feng, Dazen

Author_Institution

Netra Syst. & Networking, Oracle, San Diego, CA, USA

fYear

2015

fDate

26-29 May 2015

Firstpage

762

Lastpage

767

Abstract

We present the packaging of a large multi-chip energy-efficient WDM silicon photonic interconnect prototype enabled by hybrid integration, high-accuracy optical alignment and thermal-mechanical aware design and assembly.

Keywords

elemental semiconductors; hybrid integrated circuits; integrated circuit packaging; integrated optics; integrated optoelectronics; optical communication equipment; optical design techniques; optical interconnections; silicon; wavelength division multiplexing; Si; energy-efficient WDM silicon photonic chip-to-chip interconnect; high-accuracy optical alignment; hybrid integration; packaging; thermal-mechanical aware design; wavelength division multiplexing; Assembly; Integrated optics; Modulation; Optical waveguides; Photonics; Very large scale integration; Wavelength division multiplexing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th

Conference_Location

San Diego, CA

Type

conf

DOI

10.1109/ECTC.2015.7159678

Filename

7159678