DocumentCode
3176569
Title
Computer Simulation for Bone Scaffolds on Account of Fluid-Solid Coupling Model
Author
Yanen, Wang ; Shengmin, Wei ; Yan, X.T. ; Yao, Chen ; Ming, Yang
Author_Institution
Sch. of Mechatron., Northwestern Polytech. Univ., Xi´´an, China
Volume
3
fYear
2009
fDate
25-27 Dec. 2009
Firstpage
251
Lastpage
254
Abstract
Study on the law of interstitial nutrition flow and scaffolds solid material movement and biodegradation in fluid solid coupling situations. We set up the bone scaffolds stress equation in multi-physics according to the mechanical equilibrium condition, and the coefficient dynamic model between porosity and permeability based on Darcy´s law. Meanwhile, based on the hydromechanics continuity equation and consideration of the deformation of skeleton and the compressibility of the fluid, obtained the whole fluid flow continuity equation. On these equations and some governing equations and constraint conditions for fluid solid coupling in porous scaffolds, it established the bone scaffolds fluid-solid fully coupling mathematical model under the saturated porous medium. Furthermore, we have analyzed the bone scaffolds stresses, interstitial fluid flow pressure and seepage velocity fields through the COMSOL platform.
Keywords
artificial organs; biological fluid dynamics; biology computing; bone; digital simulation; flow through porous media; two-phase flow; COMSOL platform; bone scaffolds simulation; bone scaffolds stress equation; computer simulation; fluid-solid coupling model; hydromechanics continuity equation; interstitial nutrition flow; mechanical equilibrium condition; saturated porous medium; scaffolds solid material movement; skeleton deformation; whole fluid flow continuity equation; Biodegradable materials; Biodegradation; Biological materials; Bones; Computer simulation; Equations; Fluid dynamics; Fluid flow; Solids; Stress; bone scaffolds; fluid-structure coupling; saturated porous medium; seepage flow;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer Science-Technology and Applications, 2009. IFCSTA '09. International Forum on
Conference_Location
Chongqing
Print_ISBN
978-0-7695-3930-0
Electronic_ISBN
978-1-4244-5423-5
Type
conf
DOI
10.1109/IFCSTA.2009.301
Filename
5384824
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