• DocumentCode
    3176701
  • Title

    Analysis of hot carrier effects in low temperature poly-Si TFTs using device simulator

  • Author

    Uraoka, Y. ; Hatayama, T. ; Fuyuki, T. ; Kawamura, T. ; Tsuchihashi, Y.

  • Author_Institution
    Nara Inst. of Sci. & Technol., Japan
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    251
  • Lastpage
    256
  • Abstract
    Hot carrier degradation in low temperature poly-Si TFTs was analyzed using a device simulator. Degradation was found to be dominated by drain avalanche hot carriers (DAHC). The LDD structure was effective for improvement of the reliability. Degradation did not depend simply on the amount of hot carriers, but it was confirmed that hot carriers above the threshold energy induce the degradation
  • Keywords
    cryogenic electronics; elemental semiconductors; hot carriers; semiconductor device models; semiconductor device reliability; semiconductor device testing; silicon; thin film transistors; DAHC; LDD structure; Si; device simulator; drain avalanche hot carriers; hot carrier degradation; hot carrier effects; low temperature poly-Si TFTs; reliability; Analytical models; Crystallization; Degradation; Hot carrier effects; Hot carriers; Materials science and technology; Stress; Temperature; Thin film transistors; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronic Test Structures, 2001. ICMTS 2001. Proceedings of the 2001 International Conference on
  • Conference_Location
    Kobe
  • Print_ISBN
    0-7803-6511-9
  • Type

    conf

  • DOI
    10.1109/ICMTS.2001.928671
  • Filename
    928671