DocumentCode
3177365
Title
Electrical conduction and breakdown in sol-gel derived PZT thin films
Author
Moazzami, Reza ; Hu, Chenming ; Shepherd, William H.
Author_Institution
Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
fYear
1990
fDate
27-29 March 1990
Firstpage
231
Lastpage
236
Abstract
The viability of lead zirconate titanate (PZT) films as a storage dielectric for DRAM applications is discussed. 4000 AA PZT films with an effective SiO/sub 2/ thickness less than 17 AA were prepared by sol-gel deposition. The films exhibited ohmic behavior at low fields and exponential field dependence at high fields. The conduction characteristics can be modeled accurately using expressions derived for ionic conductivity. At the same effective SiO/sub 2/ field, the leakage and time-dependent dielectric breakdown (TDDB) characteristics are superior to other dielectric structures. However, lifetime extrapolations to worst-case operating conditions show that TDDB may be a very serious limitation for DRAM applications. Optimization of material properties of PZT films, especially the TDDB lifetime, is necessary for reliable DRAM operation.<>
Keywords
DRAM chips; electric breakdown of solids; electronic conduction in insulating thin films; ferroelectric storage; ferroelectric thin films; lead compounds; 4000 A; DRAM applications; PZT thin films; PbZrO3TiO3; TDDB; conduction characteristics; electric breakdown; electrical conduction; exponential field dependence; high fields; ionic conductivity; leakage; lifetime extrapolations; low fields; ohmic behavior; sol-gel deposition; storage dielectric; time-dependent dielectric breakdown; worst-case operating conditions; Capacitance-voltage characteristics; Capacitors; Dielectrics; Electric breakdown; Ferroelectric materials; Material storage; Polarization; Random access memory; Transistors; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1990. 28th Annual Proceedings., International
Conference_Location
New Orleans, LA, USA
Type
conf
DOI
10.1109/RELPHY.1990.66092
Filename
66092
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