The Growth Behaviors of IMC Layers in Solid-liquid Interfacial Reactions of Sn1.5Cu/Cu in High Magnetic Field

Author

Cheng, Cong-Qian ; Zhao, Jie ; Xu, Yang ; Xu, Fu-Min ; Huang, Ming-Liang

Author_Institution

Dalian Univ. of Technol., Dalian

fYear

2007

fDate

26-28 June 2007

Firstpage

1

Lastpage

4

Abstract

The growth behaviors of intermetallic compound (IMC) layers in solid-liquid interfacial reactions of Sn1.5Cu/Cu in various intensities of high magnetic field have been investigated. The results show that the growth of IMC layers has been accelerated by high magnetic field through the comparison of growth kinetics of IMC layers among OT to 2.5 T magnetic field. IMC grains in high magnetic field are much bigger than that in OT. By the analyzing of XRD patterns of IMC layers, it can be found that the orientations of IMC have been changed by magnetic field.

Keywords

X-ray diffraction; alloys; copper compounds; metallic thin films; tin compounds; Sn_1.5Cu-Cu; XRD patterns; intermetallic compound; intermetallic layers; magnetic field; solid-liquid interfacial reactions; Aging; Bars; Intermetallic; Kinetic theory; Magnetic fields; Materials science and technology; Morphology; Scanning electron microscopy; Solids; X-ray scattering; IMC layer; Sn1.5Cu/Cu; growth behavior; high magnetic field;

fLanguage

English

Publisher

ieee

Conference_Titel

High Density packaging and Microsystem Integration, 2007. HDP '07. International Symposium on

Conference_Location

Shanghai

Print_ISBN

1-4244-1253-6

Electronic_ISBN

1-4244-1253-6

Type

conf

DOI

10.1109/HDP.2007.4283576

Filename

4283576