Preparation Techniques and Characterization for Sn-3.0Ag-0.5Cu Nanopowders

Author

Xia, Xinzhi ; Zou, Changdong ; Gao, Yulai ; Liu, Johan ; Zhai, Qijie

Author_Institution

Sch. of Mater. Sci. & Eng., Shanghai Univ., Shanghai

fYear

2007

fDate

26-28 June 2007

Firstpage

1

Lastpage

4

Abstract

Nanopowders of Sn-3.0Ag-0.5Cu (wt.%) alloy, which has the promising potential applications in microelectronics packaging as the lead free solder, were prepared under the protection of three various coolants. The oxidation of the nanopowders was measured by X-ray diffraction (XRD) and other relative methods to compare the protection of the nanopowders during their preparation. Moreover, the scanning electron microscope (SEM) was employed to measure the morphology and size of these nanopowders. It was observed that the Sn-based nanopowders were almost spherical in shape. In addition, the results showed that nearly the total powders are smaller than 100 nm.

Keywords

X-ray diffraction; copper alloys; integrated circuit packaging; nanoelectronics; nanoparticles; oxidation; particle size; scanning electron microscopy; silver alloys; solders; tin alloys; SEM; SnAgCu; X-ray diffraction measurement; XRD; lead free solder; microelectronics packaging; nanopowders characterization; nanopowders morphology; nanopowders oxidation; nanopowders preparation techniques; nanopowders protection; nanopowders size; scanning electron microscope; Coolants; Environmentally friendly manufacturing techniques; Lead; Microelectronics; Nanoparticles; Oxidation; Packaging; Protection; Scanning electron microscopy; X-ray diffraction;

fLanguage

English

Publisher

ieee

Conference_Titel

High Density packaging and Microsystem Integration, 2007. HDP '07. International Symposium on

Conference_Location

Shanghai

Print_ISBN

1-4244-1252-8

Electronic_ISBN

1-4244-1253-6

Type

conf

DOI

10.1109/HDP.2007.4283616

Filename

4283616