• DocumentCode
    3185906
  • Title

    Electron microscopy study of contact layers in n-type 4H-SiC after diffusion welding

  • Author

    Korolkov, O. ; Sleptsuk, N. ; Sitnikova, A. ; Rang, T.

  • Author_Institution
    Dept. of Electron., TTU, Tallinn
  • fYear
    2008
  • fDate
    6-8 Oct. 2008
  • Firstpage
    91
  • Lastpage
    94
  • Abstract
    In the present work the results of transmission electron microscopy (TEM) and electron diffraction investigations of subcontact layers in n0-n- 4H-SiC epistructure after diffusion welding (DW) are given. TEM examinations show that at the boundary between aluminium and silicon carbide the interface layer of ~ 25 nm thickness exists and this layer is of strip character. The image of contact area obtained in diffracted SiC rays (dark field) apparently confirms that stripy zone belongs to silicon carbide. Diffraction picture obtained from bulk zone of silicon carbide looks like monocrystalline, but the pattern obtained from the subcontact layer (stripy zone) gives the evidence of existence of small-grained phase. Deciphering of this electron-diffraction pattern reveals the presence of such elements as residue SiC, Al, Si, and inclusions of graphite.
  • Keywords
    aluminium; deformation; electron diffraction; graphite; metal-insulator boundaries; shear strength; silicon compounds; transmission electron microscopy; welding; SiC-Al; SiC-C; SiC-Si; TEM; aluminium; diffusion welding; electron diffraction pattern; n-type 4H-SiC epistructure; shear microdeformation; silicon carbide; transmission electron microscopy; Amorphous materials; Diffraction; Effective mass; Electron microscopy; Optical reflection; Optical scattering; Particle scattering; Schottky barriers; Silicon carbide; Welding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Conference, 2008. BEC 2008. 11th International Biennial Baltic
  • Conference_Location
    Tallinn
  • ISSN
    1736-3705
  • Print_ISBN
    978-1-4244-2059-9
  • Electronic_ISBN
    1736-3705
  • Type

    conf

  • DOI
    10.1109/BEC.2008.4657485
  • Filename
    4657485