DocumentCode
3185906
Title
Electron microscopy study of contact layers in n-type 4H-SiC after diffusion welding
Author
Korolkov, O. ; Sleptsuk, N. ; Sitnikova, A. ; Rang, T.
Author_Institution
Dept. of Electron., TTU, Tallinn
fYear
2008
fDate
6-8 Oct. 2008
Firstpage
91
Lastpage
94
Abstract
In the present work the results of transmission electron microscopy (TEM) and electron diffraction investigations of subcontact layers in n0-n- 4H-SiC epistructure after diffusion welding (DW) are given. TEM examinations show that at the boundary between aluminium and silicon carbide the interface layer of ~ 25 nm thickness exists and this layer is of strip character. The image of contact area obtained in diffracted SiC rays (dark field) apparently confirms that stripy zone belongs to silicon carbide. Diffraction picture obtained from bulk zone of silicon carbide looks like monocrystalline, but the pattern obtained from the subcontact layer (stripy zone) gives the evidence of existence of small-grained phase. Deciphering of this electron-diffraction pattern reveals the presence of such elements as residue SiC, Al, Si, and inclusions of graphite.
Keywords
aluminium; deformation; electron diffraction; graphite; metal-insulator boundaries; shear strength; silicon compounds; transmission electron microscopy; welding; SiC-Al; SiC-C; SiC-Si; TEM; aluminium; diffusion welding; electron diffraction pattern; n-type 4H-SiC epistructure; shear microdeformation; silicon carbide; transmission electron microscopy; Amorphous materials; Diffraction; Effective mass; Electron microscopy; Optical reflection; Optical scattering; Particle scattering; Schottky barriers; Silicon carbide; Welding;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Conference, 2008. BEC 2008. 11th International Biennial Baltic
Conference_Location
Tallinn
ISSN
1736-3705
Print_ISBN
978-1-4244-2059-9
Electronic_ISBN
1736-3705
Type
conf
DOI
10.1109/BEC.2008.4657485
Filename
4657485
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