DocumentCode
3190527
Title
Evaluation of substrate noise coupling in RFICs (invited)
Author
Nagata, Makoto ; Lin, Xihua ; Azuma, Naoya ; Yamaguchi, Masahiro
Author_Institution
Dept. of Inf. Sci., Kobe Univ., Japan
fYear
2011
fDate
Nov. 30 2011-Dec. 2 2011
Firstpage
141
Lastpage
144
Abstract
Substrate noise coupling and impacts on RF integrated circuits (RFICs) have been intensively studied for intending a single chip solution of wireless communication systems. On-chip measurements characterize noises from digital parts of mixed-signal ICs in terms of noise generation as well as noise propagation through a silicon substrate, demonstrated by silicon results with sub-100 nm CMOS test vehicles. Simulation and emulation help further understanding of the interference of such noises with RFIC operation as well as their impacts on RF communication.
Keywords
CMOS integrated circuits; integrated circuit noise; integrated circuit testing; mixed analogue-digital integrated circuits; radiofrequency integrated circuits; silicon; CMOS test vehicles; RF communication; mixed-signal integrated circuits; noise propagation; on-chip measurements; radiofrequency; substrate noise coupling; wireless communication systems; CMOS RF Circuits; Signal Integrity; Substrate Noise;
fLanguage
English
Publisher
ieee
Conference_Titel
Radio-Frequency Integration Technology (RFIT), 2011 IEEE International Symposium on
Conference_Location
Beijing
Print_ISBN
978-1-4577-0517-5
Type
conf
DOI
10.1109/RFIT.2011.6141785
Filename
6141785
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