• DocumentCode
    3190790
  • Title

    Table of contents

  • fYear
    2010
  • fDate
    25-27 Oct. 2010
  • Firstpage
    1
  • Lastpage
    7
  • Abstract
    The following topics are dealt with: electronic packaging and systems; low power link design; signal integrity; through silicon via (TSV) modeling; power integrity; advanced interconnect modeling; RF packaging; scattering parameter tabular data model; statistical link performance; EM modeling; and design and analysis of high speed links.
  • Keywords
    electromagnetic compatibility; electronics packaging; low-power electronics; statistical analysis; three-dimensional integrated circuits; EM modeling; RF packaging; TSV modeling; advanced interconnect modeling; electronic packaging; high speed link; low power link design; power integrity; scattering parameter tabular data model; signal integrity; statistical link performance; through-silicon-via technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging and Systems (EPEPS), 2010 IEEE 19th Conference on
  • Conference_Location
    Austin, TX
  • Print_ISBN
    978-1-4244-6865-2
  • Electronic_ISBN
    978-1-4244-6866-9
  • Type

    conf

  • DOI
    10.1109/EPEPS.2010.5642528
  • Filename
    5642528
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3190790