DocumentCode
3191462
Title
Parameters variability effects on microstrip interconnects via Hermite polynomial Chaos
Author
Manfredi, Paolo ; Stievano, Igor S. ; Canavero, Flavio G.
Author_Institution
Dipt. di Elettron., Politec. di Torino, Torino, Italy
fYear
2010
fDate
25-27 Oct. 2010
Firstpage
149
Lastpage
152
Abstract
This paper focuses on the derivation of an enhanced transmission-line model allowing to describe a realistic high-speed interconnect with the inclusion of external uncertainties, like tolerances or process variations. The proposed method, that is based on the expansion of the well-known telegraph equations in terms of Hermite polynomials, turns out to be accurate and more efficient than alternative solutions like Monte Carlo in determining the transmission-line response sensitivity to parameters variability. Two application examples involving the frequency-domain analysis of realistic PCB microstrip structures conclude the paper.
Keywords
frequency-domain analysis; integrated circuit interconnections; polynomials; transmission lines; Hermite polynomial chaos; PCB microstrip structures; enhanced transmission line model; external uncertainties; frequency-domain analysis; high-speed interconnect; microstrip interconnects; parameters variability effects; telegraph equations; transmission-line response sensitivity; Chaos; Computational modeling; Mathematical model; Polynomials; Stochastic processes; Transmission lines; Circuit Simulation; Circuit modeling; Stochastic analysis; Transmission-lines; Uncertainty; tolerance analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2010 IEEE 19th Conference on
Conference_Location
Austin, TX
Print_ISBN
978-1-4244-6865-2
Electronic_ISBN
978-1-4244-6866-9
Type
conf
DOI
10.1109/EPEPS.2010.5642568
Filename
5642568
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