• DocumentCode
    3191462
  • Title

    Parameters variability effects on microstrip interconnects via Hermite polynomial Chaos

  • Author

    Manfredi, Paolo ; Stievano, Igor S. ; Canavero, Flavio G.

  • Author_Institution
    Dipt. di Elettron., Politec. di Torino, Torino, Italy
  • fYear
    2010
  • fDate
    25-27 Oct. 2010
  • Firstpage
    149
  • Lastpage
    152
  • Abstract
    This paper focuses on the derivation of an enhanced transmission-line model allowing to describe a realistic high-speed interconnect with the inclusion of external uncertainties, like tolerances or process variations. The proposed method, that is based on the expansion of the well-known telegraph equations in terms of Hermite polynomials, turns out to be accurate and more efficient than alternative solutions like Monte Carlo in determining the transmission-line response sensitivity to parameters variability. Two application examples involving the frequency-domain analysis of realistic PCB microstrip structures conclude the paper.
  • Keywords
    frequency-domain analysis; integrated circuit interconnections; polynomials; transmission lines; Hermite polynomial chaos; PCB microstrip structures; enhanced transmission line model; external uncertainties; frequency-domain analysis; high-speed interconnect; microstrip interconnects; parameters variability effects; telegraph equations; transmission-line response sensitivity; Chaos; Computational modeling; Mathematical model; Polynomials; Stochastic processes; Transmission lines; Circuit Simulation; Circuit modeling; Stochastic analysis; Transmission-lines; Uncertainty; tolerance analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging and Systems (EPEPS), 2010 IEEE 19th Conference on
  • Conference_Location
    Austin, TX
  • Print_ISBN
    978-1-4244-6865-2
  • Electronic_ISBN
    978-1-4244-6866-9
  • Type

    conf

  • DOI
    10.1109/EPEPS.2010.5642568
  • Filename
    5642568