Fluoropolymer composite multichip modules

Summary form only given. Consideration is given to an additive copper/polyimide process for manufacture of multichip modules and other advanced circuitry. This process allows efficient routing of most MCM (multichip module) designs, low-resistance copper conductors, and solid copper thermal vias for heat removal. It also allows large substrates (4×4 in. and greater) to be manufactured. Fluoropolymer composite materials with electrical and mechanical properties which address the needed MCM material improvements have been developed. Combining these materials with a sequential plating and lamination process yields multichip modules which offer unique solutions to the performance requirements of high-speed, high-density, high-reliability MCMs