Fundamental investigation of roll bond heat pipe as heat spreader plate for notebook computers

Author

Take, K. ; Furukawa, Y. ; Ushioda, S.

Author_Institution

Res. & Dev., Showa Aluminum Corp., Tokyo, Japan

fYear

1998

fDate

27-30 May 1998

Firstpage

501

Lastpage

506

Abstract

A roll bond heat pipe (RBHP) is very promising in the cooling of electronic equipment such as notebook computers. This study presents prediction data on maximum capillary limit obtained for the RBHP with 7.8 mm wide flow channel. Furthermore, experimental data on the thermal performance of the RBHP shows the temperature drop on the RBHP between the highest and lowest temperatures. These data determine the optimum working fluid charge volume and number of capillary loops for the RBHP

Keywords

capillarity; cooling; electronic equipment testing; heat pipes; notebook computers; thermal analysis; 7.8 mm; capillary loops; cooling; electronic equipment; flow channel width; heat spreader plate; maximum capillary limit; notebook computers; optimum working fluid charge volume; prediction data; roll bond heat pipe; temperature drop; thermal performance; Aluminum; Bonding; Computer aided manufacturing; Contact resistance; Friction; Hydraulic diameter; Microcomputers; Permeability; Resistance heating; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal and Thermomechanical Phenomena in Electronic Systems, 1998. ITHERM '98. The Sixth Intersociety Conference on

Conference_Location

Seattle, WA

ISSN

1089-9870

Print_ISBN

0-7803-4475-8

Type

conf

DOI

10.1109/ITHERM.1998.689610

Filename

689610