• DocumentCode
    3194268
  • Title

    An interface circuit for time-multiplexed electrostatic drive and sample of electrostatic mems mirror

  • Author

    Maruyama, Satoshi ; Konishi, Toshifumi ; Machida, Katsuyuki ; Fujita, Hiroyuki ; Toshiyoshi, Hiroshi

  • Author_Institution
    VLSI Design & Educ. Center, Univ. of Tokyo, Tokyo, Japan
  • fYear
    2015
  • fDate
    27-30 April 2015
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    This paper reports on an interface circuit for microelectromechanical systems (MEMS) electrostatic actuators by reading the stored electrical charge to speculate the mechanical displacement in a time-multiplexing manner. A pass transistor is inserted between the drive source and the actuator to intermittently apply the pulse-width modulated (PWD) voltage at a given voltage height to control the analog displacement of the actuator, while the stored charge is sampled at a fast speed higher than the electromechanical resonance of the actuator so that its displacement is not affected by reading. We developed an integrated circuit (IC) based on the switched capacitor model by using the 0.35-micron CMOS technology. The read/drive circuit is universally used for two-port electrostatic actuators without changing the micromechanical structures.
  • Keywords
    CMOS integrated circuits; electrostatic actuators; switched capacitor networks; CMOS technology; analog displacement; electrical charge; electromechanical resonance; electrostatic MEMS mirror; electrostatic actuators; integrated circuit; interface circuit; mechanical displacement; microelectromechanical systems; pass transistor; pulse-width modulated voltage; read-drive circuit; size 0.35 mum; switched capacitor model; time-multiplexed electrostatic drive; Actuators; Capacitors; Electrostatics; Integrated circuits; Micromechanical devices; Mirrors; Voltage control; a time-multiplexing manner; drive and sample; electrostatic MEMS actuator; interface circuit; two-terminal element;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2015 Symposium on
  • Conference_Location
    Montpellier
  • Print_ISBN
    978-1-4799-8627-9
  • Type

    conf

  • DOI
    10.1109/DTIP.2015.7161023
  • Filename
    7161023