• DocumentCode
    3194448
  • Title

    Parylene-C encapsulation for polymeric cantilever stability

  • Author

    Maheshwari, Nidhi ; Chatterjee, Gaurav ; Vinchurkar, Madhuri ; Gupta, Gaurav ; Kshirsagar, Hemant ; Narsimhan, K.L. ; Rao, V. Ramgopal

  • Author_Institution
    Dept. of Electr. Eng., IIT Bombay, Mumbai, India
  • fYear
    2015
  • fDate
    27-30 April 2015
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    Piezo-resistive polymeric cantilevers utilizing SU-8/Carbon Black composite as the piezoresistor and SU-8 as structural layer have been studied extensively for biological and chemical sensing. Owing to their better sensitivity than their Silicon counterparts as well as ease of fabrication, they have found wide spread use for ultra-sensitive detection. The extended use of these cantilevers in aqueous buffers and organic solvents like ethanol make them unstable, leading to erroneous results. It is suspected that absorption of moisture and organic solvents in the bulk and/or the penetration of ions in the case of aqueous buffers, in turn effecting the piezoresistivity, contribute towards this unstable behaviour. The present study demonstrates the encapsulation of cantilevers with varied thickness of Parylene-C and the subsequent stability of cantilevers in buffers and organic solvents.
  • Keywords
    cantilevers; encapsulation; microfabrication; micromechanical devices; piezoresistive devices; polymer blends; solvents (industrial); Parylene-C; SU-8-carbon black composite; aqueous buffers; cantilevers encapsulation; ethanol; moisture absorption; organic solvents; piezo-resistive polymeric cantilevers; piezoresistivity; piezoresistor; ultra-sensitive detection; Chemicals; Ethanol; Films; Optical sensors; Polymers; Silicon; Cantilever; Parylene; Piezoresistive; SU-8; encapsulation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2015 Symposium on
  • Conference_Location
    Montpellier
  • Print_ISBN
    978-1-4799-8627-9
  • Type

    conf

  • DOI
    10.1109/DTIP.2015.7161032
  • Filename
    7161032