High yield thermode bond process under activated atmosphere and inline thermal interface measurement for high power optoelectronic devices

Author

Elger, Gordon ; Lauterbach, Reinhard ; Feder, Reiner ; Dankwart, Kurt ; Zilkens, Christopher

Author_Institution

Global Technol. Dev. Mechanization, Philips Technol. GmbH, Aachen, Germany

fYear

2010

fDate

13-16 Sept. 2010

Firstpage

1

Lastpage

5

Abstract

The paper reports two equipment development projects in the field of die bonding and die bond testing. Part one deals with the a new confinement system for flux free die bond processes under formic acid enriched process gas on thermode bonders. Part two describes a new inline test equipment for controlling the solder joints by applying the transient temperature test method under inline condition.

Keywords

microassembling; optoelectronic devices; solders; temperature measurement; activated atmosphere; confinement system; die bond testing; equipment development project; flux free die bond process; formic acid enriched process gas; high yield thermode bond process; inline test equipment; inline thermal interface measurement; optoelectronic devices; solder joint control; thermode bonder; transient temperature test method; Resistance heating; Switches;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic System-Integration Technology Conference (ESTC), 2010 3rd

Conference_Location

Berlin

Print_ISBN

978-1-4244-8553-6

Electronic_ISBN

978-1-4244-8554-3

Type

conf

DOI

10.1109/ESTC.2010.5642812

Filename

5642812