HT/sub c/ superconductive interconnections SPICE modeling for microwave applications

Author

Vu Dinh, T. ; Cabon, B. ; Chilo, J.

Author_Institution

LEMO-ENSERG, Grenoble, France

fYear

1992

fDate

18-25 June 1992

Abstract

Summary form only give. An original modeling concept describing superconducting material through an equivalent circuit is proposed. It allows superconducting interconnections to be analyzed using any electrical nodal simulator (SPICE, for example). A typical superconducting microstrip line has been analyzed. The variations of the attenuation constant at 77 K versus frequency calculated by the proposed equivalent circuit method and by the PEM method of H.Y.-Lee et al. (see IEEE Trans. on Micro. Theory and Tech. vol.37, no.12, p.1904, 1989) are shown. A good agreement between these two results is observed.<>

Keywords

SPICE; circuit analysis computing; equivalent circuits; high-temperature superconductors; microstrip lines; packaging; superconducting microwave devices; PEM method; SPICE modeling; attenuation constant; electrical nodal simulator; equivalent circuit; frequency; high T/sub c/ superconductive interconnections; microwave applications; superconducting material; superconducting microstrip line; Circuit simulation; Conductors; Current density; Equivalent circuits; Integrated circuit interconnections; SPICE; Superconducting materials; Superconducting microwave devices; Superconductivity; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Antennas and Propagation Society International Symposium, 1992. AP-S. 1992 Digest. Held in Conjuction with: URSI Radio Science Meeting and Nuclear EMP Meeting., IEEE

Conference_Location

Chicago, IL, USA

Print_ISBN

0-7803-0730-5

Type

conf

DOI

10.1109/APS.1992.221784

Filename

221784