• DocumentCode
    3198004
  • Title

    Power cycling tests at high temperatures with IGBT power modules for hybrid electrical vehicle applications

  • Author

    Hensler, A. ; Lutz, J. ; Thoben, M. ; Zachariae, J.

  • Author_Institution
    Chemnitz Univ. of Technol., Chemnitz, Germany
  • fYear
    2010
  • fDate
    13-16 Sept. 2010
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    In this publication, test results of power cycling tests are presented with 600V IGBT power modules for hybrid electrical vehicle (HEV) applications at high junction temperatures. First, the power cycling capability of standard packaging technology in wide ΔTj range is investigated. Afterwards the reliability improvement of new packaging technologies is shown.
  • Keywords
    hybrid electric vehicles; insulated gate bipolar transistors; semiconductor device packaging; semiconductor device reliability; IGBT power modules; hybrid electrical vehicle applications; power cycling tests; standard packaging technology; voltage 600 V; Cooling; Insulated gate bipolar transistors; Junctions; Multichip modules; Reliability; Temperature measurement; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic System-Integration Technology Conference (ESTC), 2010 3rd
  • Conference_Location
    Berlin
  • Print_ISBN
    978-1-4244-8553-6
  • Electronic_ISBN
    978-1-4244-8554-3
  • Type

    conf

  • DOI
    10.1109/ESTC.2010.5642894
  • Filename
    5642894
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3198004