Modeling and analysis of coplanar bonding wires for high-speed applications

Author

Tschoban, Christian ; Ndip, Ivan ; Schmidt, Stefan ; Guttowski, Stephan ; Schneider-Ramelow, Martin ; Lang, Klaus-Dieter ; Reichl, Herbert

Author_Institution

IZM, Fraunhofer Inst. for Reliability & Microintegration, Berlin, Germany

fYear

2010

fDate

13-16 Sept. 2010

Firstpage

1

Lastpage

4

Abstract

In this contribution, two-conductor and coplanar bond wire configurations are modeled, analyzed and compared. The impact of the pitch of the bond wires and the distance of separation between the signal wire and a nearby reference plane, on RF performance are quantified for GSM 900/1800, 2.4 GHz/5GHz WLAN and high-speed applications above 10 GHz. Considering a bond wire diameter of 50 μm, length of 1mm and pitch of 100 μm, it is found that almost 3 times more power is lost through the two-conductor model than coplanar configuration at 10 GHz. This makes the coplanar configuration more suited for high-speed applications.

Keywords

cellular radio; conductors (electric); lead bonding; wireless LAN; GSM 900/1800; RF performance; WLAN; coplanar bond wire configuration; frequency 10 GHz; frequency 2.4 GHz; frequency 5 GHz; high-speed application; two-conductor configuration; Artificial neural networks; GSM; Integrated circuit modeling; Next generation networking; Radio frequency;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic System-Integration Technology Conference (ESTC), 2010 3rd

Conference_Location

Berlin

Print_ISBN

978-1-4244-8553-6

Electronic_ISBN

978-1-4244-8554-3

Type

conf

DOI

10.1109/ESTC.2010.5642896

Filename

5642896