• DocumentCode
    3198262
  • Title

    Constant voltage electromigration testing

  • Author

    Lloyd, J.R. ; Connelly, N. ; Zhang, Z. ; Rizzolo, M.

  • Author_Institution
    SUNY Albany CNSE, Albany, NY, USA
  • fYear
    2011
  • fDate
    16-20 Oct. 2011
  • Firstpage
    55
  • Lastpage
    58
  • Abstract
    Constant voltage electromigration was investigated as a method for assessing reliability in narrow Cu conductors. It is demonstrated theoretically that constant voltage (CV) testing can offer advantages over constant current (CC) testing for material that may vary significantly in geometry (thickness or line width) from sample to sample. Using known misprocessed material, this anticipated result was confirmed. Experiments with material that was properly produced showed that the advantages of CV over CC were minimal, but the values of the median time to failure and the lognormal standard deviation of the CC and CV stressed material agreed quite well. A potential difference in the failure distribution was observed, but needs to be confirmed.
  • Keywords
    conductors (electric); electromigration; reliability; testing; CC stressed material; CC testing; CV stressed material; CV testing; conductors; constant current testing; constant voltage electromigration testing; failure distribution; lognormal standard deviation; misprocessed material; Conductors; Correlation; Current density; Electromigration; Materials; Resistance; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Reliability Workshop Final Report (IRW), 2011 IEEE International
  • Conference_Location
    South Lake Tahoe, CA
  • ISSN
    1930-8841
  • Print_ISBN
    978-1-4577-0113-9
  • Type

    conf

  • DOI
    10.1109/IIRW.2011.6142588
  • Filename
    6142588