DocumentCode
3198262
Title
Constant voltage electromigration testing
Author
Lloyd, J.R. ; Connelly, N. ; Zhang, Z. ; Rizzolo, M.
Author_Institution
SUNY Albany CNSE, Albany, NY, USA
fYear
2011
fDate
16-20 Oct. 2011
Firstpage
55
Lastpage
58
Abstract
Constant voltage electromigration was investigated as a method for assessing reliability in narrow Cu conductors. It is demonstrated theoretically that constant voltage (CV) testing can offer advantages over constant current (CC) testing for material that may vary significantly in geometry (thickness or line width) from sample to sample. Using known misprocessed material, this anticipated result was confirmed. Experiments with material that was properly produced showed that the advantages of CV over CC were minimal, but the values of the median time to failure and the lognormal standard deviation of the CC and CV stressed material agreed quite well. A potential difference in the failure distribution was observed, but needs to be confirmed.
Keywords
conductors (electric); electromigration; reliability; testing; CC stressed material; CC testing; CV stressed material; CV testing; conductors; constant current testing; constant voltage electromigration testing; failure distribution; lognormal standard deviation; misprocessed material; Conductors; Correlation; Current density; Electromigration; Materials; Resistance; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Reliability Workshop Final Report (IRW), 2011 IEEE International
Conference_Location
South Lake Tahoe, CA
ISSN
1930-8841
Print_ISBN
978-1-4577-0113-9
Type
conf
DOI
10.1109/IIRW.2011.6142588
Filename
6142588
Link To Document