• DocumentCode
    319853
  • Title

    Packaging and manufacturing trends for the server power supply

  • Author

    Stratas, Christopher J.

  • Author_Institution
    Celestica Inc., North York, Ont., Canada
  • Volume
    1
  • fYear
    1998
  • fDate
    15-19 Feb 1998
  • Firstpage
    254
  • Abstract
    The server power supply market is undergoing a revolution. Advances in microprocessor technology are enabling a wider range of companies to enter the workstation and enterprise level server markets, including most of the personal computer manufacturers. The arrival of the traditional low-end power supplier into the high-end marketplace creates a threat to existing power supply companies. This paper examines changes in power supply packaging and manufacturing methods that attempt to provide increased power density and function, while reducing overall system cost
  • Keywords
    computer power supplies; manufacture; network servers; surface mount technology; enterprise level server market; high-end marketplace; increased power density; low-end power supplier; manufacturing trends; microprocessor technology; overall system cost reduction; packaging trends; personal computer manufacturers; power supply packaging; server power supply; surface mount technology; workstation market; Companies; Computer aided manufacturing; Computer architecture; Costs; Microcomputers; Microprocessors; Packaging; Portfolios; Power supplies; Workstations;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Applied Power Electronics Conference and Exposition, 1998. APEC '98. Conference Proceedings 1998., Thirteenth Annual
  • Conference_Location
    Anaheim, CA
  • Print_ISBN
    0-7803-4340-9
  • Type

    conf

  • DOI
    10.1109/APEC.1998.647699
  • Filename
    647699