• DocumentCode
    3198715
  • Title

    Simulation of power delivery networks with Joule heating effects for 3D integration

  • Author

    Xie, Jianyong ; Swaminathan, Madhavan

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    2010
  • fDate
    13-16 Sept. 2010
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    In this paper, we present the first work on simulation of power delivery network (PDN) with both Joule heating and convection effects. The finite volume formulations of DC voltage drop equation and thermal equation with convection boundary conditions are explained. In thermal simulation, both Joule heating effect from the PDN and convection effect are considered in solving the steady-state heat equation. In electrical DC voltage drop simulation, by updating the temperature-dependent electrical resistivity of the PDN, voltage distribution is obtained with temperature effects. By iterating between the electrical DC voltage drop and thermal simulations until results converge, the simulation not only enables accurate estimation of system level voltage drop with convection effects, but also provides accurate temperature distribution with convection and Joule heating effects. The simulation results show that even with natural convection effects, the temperature effect on system level IR drop is about 5-10%.
  • Keywords
    electrical resistivity; finite volume methods; heating; natural convection; thermal management (packaging); 3D integration; DC voltage drop equation; Joule heating effects; convection boundary conditions; finite volume formulations; natural convection effects; power delivery networks; steady-state heat equation; temperature distribution; temperature-dependent electrical resistivity; thermal equation; voltage distribution; Conductivity; Equations; Heating; Mathematical model; Resistance; Temperature distribution; Three dimensional displays;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic System-Integration Technology Conference (ESTC), 2010 3rd
  • Conference_Location
    Berlin
  • Print_ISBN
    978-1-4244-8553-6
  • Electronic_ISBN
    978-1-4244-8554-3
  • Type

    conf

  • DOI
    10.1109/ESTC.2010.5642927
  • Filename
    5642927