Modeling bond wires for millimeter wave RFIC design

Author

Hauptmann, Stefan ; Hellfeld, Marcus ; Knochenhauer, Christian ; Ellinger, Frank

Author_Institution

Dept. of Circuit Design & Network Theor., Dresden Univ. of Technol., Dresden, Germany

fYear

2009

fDate

9-11 Nov. 2009

Firstpage

1

Lastpage

4

Abstract

This paper discusses how bond wires can be accurately modeled for circuits operating at several 10 GHz. To obtain exact results a more sophisticated model than the commonly-used inductor with around 0.8 nH/mm is required. An edge-based multiple conductor transmission line (mtline) model is presented, and it is demonstrated how its parameters can be extracted from EM simulations. A comparison of the mtline model with a lumped components model demonstrates the advantages of the mtline approach.

Keywords

MIMIC; lead bonding; lumped parameter networks; multiconductor transmission lines; wires (electric); EM simulations; bond wire modelling; edge-based multiple conductor transmission line model; frequency 10 GHz; inductor; lumped components model; millimeter wave RFIC design; mtline model; Bonding; Frequency; Inductance; Inductors; Integrated circuit packaging; Millimeter wave technology; Multiconductor transmission lines; Radiofrequency integrated circuits; Solid modeling; Wires; Bonding; Integrated circuit packaging; Multi-conductor transmission lines;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwaves, Communications, Antennas and Electronics Systems, 2009. COMCAS 2009. IEEE International Conference on

Conference_Location

Tel Aviv

Print_ISBN

978-1-4244-3985-0

Type

conf

DOI

10.1109/COMCAS.2009.5386057

Filename

5386057