• DocumentCode
    3200806
  • Title

    Spherical polymer particles in isotropic conductive adhesives a study on rheology and mechanical aspects

  • Author

    Nguyen, Hoang-Vu ; Kristiansen, Helge ; Gakkestad, Jakob ; Johannessen, Rolf ; Hoivik, Nils ; Aasmundtveit, Knut E.

  • Author_Institution
    Inst. of Micro & Nano Syst. Technol., HiVe-Vestfold Univ. Coll., Borre, Norway
  • fYear
    2010
  • fDate
    13-16 Sept. 2010
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    Isotropic conductive adhesive (ICA) filled with metal coated polymer spheres has been studied as a novel approach to increase the flexibility, and hence the reliability of the adhesive compared to traditional metal filled ICAs. In this paper, we have investigated the rheological properties of the novel ICA to evaluate its applicability in practical use. The current work also involves the investigation of the mechanical properties including shear strength of the novel ICA. Spherical polymer particles (SPP) of sizes Ø6 μm and Ø30 μm were investigated in the present study. The results show minor differences in the rheological properties and the adhesion strength for adhesives filled with particles in different sizes. Filling SPP into the adhesive matrix increases the viscosity of the system monotonically and continuously, in excellent accordance with model systems previously reported in the literature. Furthermore, the novel ICA exhibits high mechanical shear strength, being comparable to the traditional solder joint technology and twice higher than the traditional metal filled ICA.
  • Keywords
    conductive adhesives; filled polymers; reliability; shear strength; ICA; SPP; adhesion strength; adhesive matrix; adhesive reliability; isotropic conductive adhesives; mechanical property; mechanical shear strength; metal coated polymer spheres; rheological property; solder joint technology; spherical polymer particles; system viscosity; Curing; Joints; Mathematical model; Mechanical factors; Metals; Polymers; Viscosity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic System-Integration Technology Conference (ESTC), 2010 3rd
  • Conference_Location
    Berlin
  • Print_ISBN
    978-1-4244-8553-6
  • Electronic_ISBN
    978-1-4244-8554-3
  • Type

    conf

  • DOI
    10.1109/ESTC.2010.5643022
  • Filename
    5643022