• DocumentCode
    3202718
  • Title

    Optimization of Interface Properties in a-Si:H/c-Si Heterojunction Solar Cells

  • Author

    Conrad, E. ; Maydell, K.V. ; Angermann, H. ; Schubert, C. ; Schmidt, M.

  • Author_Institution
    Hahn-Meitner-Inst. Berlin
  • Volume
    2
  • fYear
    2006
  • fDate
    38838
  • Firstpage
    1263
  • Lastpage
    1266
  • Abstract
    We report on the optimization of hydrogenated amorphous silicon/crystalline silicon (a-Si:H/c-Si) heterojunction solar cells which were completely processed at temperatures below 230degC. Efficient solar cells based on both n-type and on p-type c-Si substrates were performed. In contrast to the approach from Sanyo no additional a-Si:H(i) buffer layer was used. Instead the conditions of the amorphous silicon preparation by conventional plasma enhanced chemical vapor deposition (PECVD) were optimized and several wet- or plasma chemical treatments were applied to improve the interface properties. The highest efficiencies so far are 17.4 % on p-type c-Si wafers and 19.8 % on n-type c-Si wafers
  • Keywords
    amorphous semiconductors; buffer layers; elemental semiconductors; hydrogen; passivation; plasma CVD; semiconductor heterojunctions; silicon; solar cells; 17.4 percent; 19.8 percent; PECVD; Si; Si:H-Si; amorphous silicon; buffer layer; hydrogenated amorphous silicon-crystalline silicon heterojunction solar cells; interface properties; n-type crystalline silicon substrates; n-type crystalline silicon wafers; p-type crystalline silicon substrates; p-type crystalline silicon wafers; plasma chemical treatments; plasma enhanced chemical vapor deposition; semiconductor heterojunction solar cells; surface passivation; wet-chemical treatments; Amorphous silicon; Chemical vapor deposition; Crystallization; Heterojunctions; Photovoltaic cells; Plasma applications; Plasma chemistry; Plasma properties; Plasma temperature; Surface cleaning;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Energy Conversion, Conference Record of the 2006 IEEE 4th World Conference on
  • Conference_Location
    Waikoloa, HI
  • Print_ISBN
    1-4244-0017-1
  • Electronic_ISBN
    1-4244-0017-1
  • Type

    conf

  • DOI
    10.1109/WCPEC.2006.279643
  • Filename
    4059873