DocumentCode
3203227
Title
Hydrogen Release and Defect Formation During Heat Treatments of SiNx:H/a-Si: H Double Passivation Layer on C-SI Substrate
Author
Ulyashin, A.G. ; Bentzen, A. ; Diplas, S. ; Suphellen, A. ; Gunnaes, A.E. ; Olsen, A. ; Svensson, B.G. ; Marstein, E.S. ; Holt, A. ; Grambole, D. ; Sauar, E.
Author_Institution
Center for Mater. Sci. & Nanotechnol., Oslo Univ.
Volume
2
fYear
2006
fDate
38838
Firstpage
1354
Lastpage
1357
Abstract
The quality and temperature stability of surface passivation of silicon by a double layer consisting of a hydrogenated amorphous silicon thin film capped by a silicon nitride anti-reflection coating are studied. It is established that the passivation effect of the double layer can be significantly enhanced after short annealing for temperatures up to about 500degC, whereas annealing at higher temperatures results in degradation of the passivation properties. It is found that the increased effective recombination lifetime after annealing at temperatures below 500degC results from hydrogen redistribution in the interface region. Furthermore, presence of interfacial structural defects formed due to hydrogen release at temperatures around 600degC, is believed to be the cause of the lifetime decrease after heat treatments at higher temperatures
Keywords
amorphous semiconductors; annealing; antireflection coatings; carrier lifetime; elemental semiconductors; hydrogen; passivation; semiconductor thin films; semiconductor-insulator boundaries; silicon; silicon compounds; (SiNx:H)-Si:H; Si; annealing; carrier lifetime; defect formation; double passivation layer; heat treatments; hydrogen redistribution; hydrogenated amorphous silicon thin film; interfacial structural defects; recombination lifetime; silicon nitride antireflection coating; surface passivation; Amorphous silicon; Annealing; Heat treatment; Hydrogen; Passivation; Semiconductor thin films; Stability; Substrates; Surface treatment; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Photovoltaic Energy Conversion, Conference Record of the 2006 IEEE 4th World Conference on
Conference_Location
Waikoloa, HI
Print_ISBN
1-4244-0017-1
Electronic_ISBN
1-4244-0017-1
Type
conf
DOI
10.1109/WCPEC.2006.279682
Filename
4059896
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