DocumentCode
320827
Title
Embedded DRAM architectural trade-offs
Author
Wehn, Norbert ; Hein, Sren
Author_Institution
Inst. of Microelectron. Syst., Kaiserslautern Univ., Germany
fYear
1998
fDate
23-26 Feb 1998
Firstpage
704
Lastpage
708
Abstract
In this paper we discuss system-related aspects in embedded DRAM/logic designs. We focus on large embedded memories which have to be implemented as DRAMs
Keywords
DRAM chips; memory architecture; DRAM/logic designs; architectural trade-offs; embedded DRAM; system-related aspects; Energy consumption; Frequency; Logic devices; Logic testing; Microelectronics; Packaging; Power supplies; Random access memory; Space technology; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Design, Automation and Test in Europe, 1998., Proceedings
Conference_Location
Paris
Print_ISBN
0-8186-8359-7
Type
conf
DOI
10.1109/DATE.1998.655935
Filename
655935
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