DocumentCode
3209676
Title
A new cold cathode using pulsed laser deposited lanthanum monosulfide thin films
Author
Samiee, M. ; Garre, K. ; Cahay, M. ; Kosel, P.B. ; Fairchild, S. ; Fraser, J.W. ; Lockwood, D.J.
Author_Institution
Univ. of Cincinnati, Cincinnati
fYear
2007
fDate
8-12 July 2007
Firstpage
32
Lastpage
33
Abstract
Using MEMS technology, an array of cold cathodes was fabricated by pulsed laser deposition (PLD) of chemically and thermally stable lanthanum monosulfide (LaS) thin film anode and cathode contacts. The latter were defined via etching and processing of two different pieces of (100) Si wafers separated via a highly resistive sputter deposited aluminum nitride (AlN) layer whose thickness was used to control the anode to cathode spacing. The top and bottom Si wafers were aligned and glued together using high temperature, vacuum compatible epoxy. Field emission (FE) characteristics were recorded in a vacuum chamber with a base pressure near 10-7 Torr. An average electric field threshold for Fowler-Nordheim (FN) field emission in the range of 100 V/mum was measured. A maximum current density of 8 mA/ cm2 was recorded which is large enough for flat panel display applications. The largest emission current measured was about 5X10-7 A above which thermal runaway occurred leading to a failure of the cathode. The failure mechanism is most likely due to Joule heating in the aluminum (Al) thin film underneath the LaS cathodes.
Keywords
aluminium compounds; cathodes; etching; field emission displays; lanthanum compounds; micromachining; pulsed laser deposition; silicon; sputtered coatings; AlN; Fowler-Nordheim field emission; Joule heating; LaS; MEMS technology; Si; aluminum thin film; anode- to -cathode spacing; chemically stable thin film anode; chemically stable thin film cathode contacts; cold cathode array fabrication; current density; electric field threshold; emission current measurement; failure mechanism; field emission characteristics; flat panel display applications; high resistive sputter deposited aluminum nitride layer; pulsed laser deposited lanthanum monosulfide thin films; silicon wafers; thermally stable thin film anode; thermally stable thin film cathode contacts; vacuum compatible epoxy; Anodes; Cathodes; Chemical lasers; Chemical technology; Lanthanum; Micromechanical devices; Optical arrays; Optical pulses; Pulsed laser deposition; Sputtering;
fLanguage
English
Publisher
ieee
Conference_Titel
Vacuum Nanoelectronics Conference, 2007. IVNC. IEEE 20th International
Conference_Location
Chicago, IL
Print_ISBN
978-1-4244-1133-7
Electronic_ISBN
978-1-4244-1134-4
Type
conf
DOI
10.1109/IVNC.2007.4480920
Filename
4480920
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