DocumentCode
3209969
Title
Development of a vacuum packaged nanodiamond lateral field emission device
Author
Subramanian, K. ; Schroeder, R. ; Kang, W.P. ; Davidson, J.L.
Author_Institution
Vanderbilt Univ., Nashville
fYear
2007
fDate
8-12 July 2007
Firstpage
70
Lastpage
71
Abstract
Vacuum microelectronic devices involving lateral-type emitters offer reduced complexity for device integration and vacuum packaging. In addition, their small interelectrode separation feature results in low voltage device operation, essential for practical microelectronic applications. Utilizing the properties of CVD nanocrystalline diamond, we have demonstrated a lateral field emission device capable of functioning efficiently at both low and high temperatures (200 degC), with an inherent "hardness" to radiation exposure as high as 15 Mrad(SiO2) total dose (Kang, et.al., 2007). The development of a vacuum package is of practical relevance to field emission devices. We report the development of the first diamond lateral field emitter device operating in a vacuum package.
Keywords
chemical vapour deposition; integrated circuit packaging; silicon compounds; CVD nanocrystalline diamond; device integration; interelectrode separation; lateral field emission device; lateral type emitters; low voltage device operation; nanodiamond; vacuum microelectronic devices; vacuum packaging; Anodes; Cathodes; Diodes; Elementary particle vacuum; Nanoscale devices; Packaging; Sensor arrays; Surface morphology; Temperature; Vacuum systems;
fLanguage
English
Publisher
ieee
Conference_Titel
Vacuum Nanoelectronics Conference, 2007. IVNC. IEEE 20th International
Conference_Location
Chicago, IL
Print_ISBN
978-1-4244-1133-7
Electronic_ISBN
978-1-4244-1134-4
Type
conf
DOI
10.1109/IVNC.2007.4480936
Filename
4480936
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