• DocumentCode
    3209969
  • Title

    Development of a vacuum packaged nanodiamond lateral field emission device

  • Author

    Subramanian, K. ; Schroeder, R. ; Kang, W.P. ; Davidson, J.L.

  • Author_Institution
    Vanderbilt Univ., Nashville
  • fYear
    2007
  • fDate
    8-12 July 2007
  • Firstpage
    70
  • Lastpage
    71
  • Abstract
    Vacuum microelectronic devices involving lateral-type emitters offer reduced complexity for device integration and vacuum packaging. In addition, their small interelectrode separation feature results in low voltage device operation, essential for practical microelectronic applications. Utilizing the properties of CVD nanocrystalline diamond, we have demonstrated a lateral field emission device capable of functioning efficiently at both low and high temperatures (200 degC), with an inherent "hardness" to radiation exposure as high as 15 Mrad(SiO2) total dose (Kang, et.al., 2007). The development of a vacuum package is of practical relevance to field emission devices. We report the development of the first diamond lateral field emitter device operating in a vacuum package.
  • Keywords
    chemical vapour deposition; integrated circuit packaging; silicon compounds; CVD nanocrystalline diamond; device integration; interelectrode separation; lateral field emission device; lateral type emitters; low voltage device operation; nanodiamond; vacuum microelectronic devices; vacuum packaging; Anodes; Cathodes; Diodes; Elementary particle vacuum; Nanoscale devices; Packaging; Sensor arrays; Surface morphology; Temperature; Vacuum systems;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Vacuum Nanoelectronics Conference, 2007. IVNC. IEEE 20th International
  • Conference_Location
    Chicago, IL
  • Print_ISBN
    978-1-4244-1133-7
  • Electronic_ISBN
    978-1-4244-1134-4
  • Type

    conf

  • DOI
    10.1109/IVNC.2007.4480936
  • Filename
    4480936