DocumentCode
3210638
Title
Application of yield models for semiconductor yield improvement
Author
Dance, Daren L. ; Jarvis, Richard
Author_Institution
SEMATECH, Austin, TX, USA
fYear
1992
fDate
4-6 Nov 1992
Firstpage
237
Lastpage
266
Abstract
Yield models may be applied to increase the yield learning rate in semiconductor manufacture. Detailed equipment models can be used to predict the defect-limited yield from estimates of particles added per wafer pass. These general yield models may be refined to reflect specific processes, equipment, and design rules in more accurate critical area estimates. After validation, refined models can be applied to direct particle reduction and yield improvement efforts amid conflicting priorities. Yield improvements have been demonstrated by applying defect-limited yield models in a production manufacturing facility
Keywords
semiconductor device manufacture; semiconductor process modelling; critical area estimates; defect-limited yield; design rules; direct particle reduction; equipment models; production manufacturing facility; semiconductor manufacture; semiconductor yield improvement; wafer pass; yield learning rate; yield models; Acceleration; Continuous improvement; Inspection; Manufacturing; Microelectronics; Predictive models; Production; Semiconductor device manufacture; Semiconductor device modeling; Yield estimation;
fLanguage
English
Publisher
ieee
Conference_Titel
Defect and Fault Tolerance in VLSI Systems, 1992. Proceedings., 1992 IEEE International Workshop on
Conference_Location
Dallas, TX
ISSN
1550-5774
Print_ISBN
0-8186-2837-5
Type
conf
DOI
10.1109/DFTVS.1992.224349
Filename
224349
Link To Document