DocumentCode
3212297
Title
Dendrite fuse re-growth kinetics on organic substrates for microprocessors
Author
Lambert, D. ; Gannamani, R. ; Blish, R.C., II
Author_Institution
Adv. Micro Devices Inc., Sunnyvale, CA, USA
fYear
2004
fDate
25-29 April 2004
Firstpage
543
Lastpage
546
Abstract
The kinetics of dendrite fuse re-growth during Temperature Humidity Bias (THB) stresses were modeled with a power law for Relative Humidity (exponent ∼3.5) and a power law for bias voltage (exponent ∼1.35). Using these results we determined the optimal laser cut parameters to maximize product reliability.
Keywords
electric fuses; humidity; semiconductor device breakdown; semiconductor device reliability; Temperature Humidity Bias stresses; bias voltage; dendrite fuse re-growth kinetics; microprocessors; organic substrates; power law; product reliability; Anodes; Fuses; Humidity; Kinetic theory; Laser beam cutting; Microprocessors; Power lasers; Stress; Temperature; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium Proceedings, 2004. 42nd Annual. 2004 IEEE International
Print_ISBN
0-7803-8315-X
Type
conf
DOI
10.1109/RELPHY.2004.1315387
Filename
1315387
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