DocumentCode
3212307
Title
Transport mechanisms in porous silicon layer and ZnO/PSL heterostructures
Author
Vásquez-A, M.A. ; García-Salgado, G. ; Romero-Paredes, G. ; Peña-Sierra, R.
Author_Institution
Dept. of Electr. Eng. SEES, CINVESTAV-IPN, Mexico City, Mexico
fYear
2009
fDate
10-13 Jan. 2009
Firstpage
1
Lastpage
5
Abstract
The transport mechanisms in both silicon porous layers (PSL) and ZnO/PSL/c-Si heterostructures were identified by Current-Voltage (I-V) measurements. The PSL were made by anodic etching of p-type (100) Silicon (Si) wafers with resistivity of 1-5 ¿-cm. The heterostructures were manufactured by depositing a zinc oxide (ZnO) film by DC-sputtering on the previously obtained PSL. The measured electrical resistivity of the ZnO films and the PSL were of 5.3 à 105 and 5.7 à 107 ¿-cm, respectively. The current flow in the PSL is limited by the space-charge regions (SCL), due to the charge trapped in the distinct energy localized states. For the heterostructures similar results were found, where the dominant transport mechanisms are associated to the physical characteristics of the PSL and the ZnO films. Accordingly a bandgap diagram for ZnO/PSL heterostructure is proposed, where the participation of the variety of the defect levels are considered.
Keywords
II-VI semiconductors; electrical resistivity; electron traps; etching; hole traps; silicon; sputtered coatings; zinc compounds; DC sputtering; ZnO-Si; anodic etching; charge trap; current-voltage measurements; electrical resistivity; energy localized state; space charge region; transport mechanisms; Conductivity; Current measurement; Electrodes; Etching; Gold; Luminescence; Manufacturing; Silicon; Substrates; Zinc oxide; Electrical Properties; Heterojunctions; Porous Silicon Layers (PSL); Space-Charge-Limited (SCL) Mechanism; Zinc Oxide (ZnO);
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Engineering, Computing Science and Automatic Control,CCE,2009 6th International Conference on
Conference_Location
Toluca
Print_ISBN
978-1-4244-4688-9
Electronic_ISBN
978-1-4244-4689-6
Type
conf
DOI
10.1109/ICEEE.2009.5393435
Filename
5393435
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