• DocumentCode
    3215559
  • Title

    A wafer-scale MEMS and analog VLSI system for active drag reduction

  • Author

    Gupta, Bhusan ; Goodman, Rodney ; Jiang, Fukang ; Tsao, Tom ; Tai, Yu-Chong ; Tung, Steve ; Ho, Chih-Ming

  • Author_Institution
    Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
  • fYear
    1996
  • fDate
    9-11 Oct 1996
  • Firstpage
    46
  • Lastpage
    52
  • Abstract
    We describe an analog CMOS VLSI system that can process real-time signals from integrated shear stress sensors to detect regions of high shear stress along a surface in an airflow. The outputs of the CMOS circuit control the actuation of integrated micromachined flaps with the goal of reducing this high shear stress on the surface and thereby lowering the total drag. We have designed, fabricated, and tested components of this system in a wind tunnel in both laminar and turbulent flow regimes with the goal of building a wafer-scale system
  • Keywords
    CMOS analogue integrated circuits; VLSI; aircraft control; analogue processing circuits; drag reduction; laminar flow; microactuators; micromachining; microsensors; real-time systems; shear turbulence; stress control; stress measurement; wafer-scale integration; CMOS circuit; active drag reduction; air transport; aircraft; airflow; analog VLSI system; flap actuation; high shear stress detection; integrated micromachined flaps; integrated shear stress sensors; laminar flow regime; microelectromechanical systems; real-time signal processing; turbulent flow regime; wafer-scale MEMS; wafer-scale system; wind tunnel testing; CMOS process; Circuit testing; Micromechanical devices; Real time systems; Sensor phenomena and characterization; Sensor systems; Signal processing; Stress control; System testing; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Innovative Systems in Silicon, 1996. Proceedings., Eighth Annual IEEE International Conference on
  • Conference_Location
    Austin, TX
  • ISSN
    1063-2204
  • Print_ISBN
    0-7803-3639-9
  • Type

    conf

  • DOI
    10.1109/ICISS.1996.552410
  • Filename
    552410