Lead free solder process development and reliability for handset application

Author

Zhu, Sherry ; Nguyen, Cam

Author_Institution

Kyocera Wireless Corp., San Diego, CA, USA

fYear

2005

fDate

16-18 March 2005

Firstpage

100

Lastpage

104

Abstract

Recent worldwide lead free activity has been driving international and US consumer electronic companies to be lead free. This paper identifies the challenges, critical issues and solutions for implementing lead free soldering process for handset application, and describes the studies conducted on Sn/Ag/Cu and Sn/Ag/Bi solder, process development and reliability results for handset manufacturing. The paper described wettability, printability and reflow results, electrical characterization, drop shock, thermal cycling test, humidity test and mechanical reliability results. Process DOE results are also discussed in the paper. Traditional eutectic solder is used as the baseline for comparison.

Keywords

design of experiments; reflow soldering; reliability; telephone sets; Sn-Ag-Bi; Sn-Ag-Cu; design of experiments; drop shock; electrical characterization; handset application; handset manufacturing; humidity test; lead free solder process development; lead free solder process reliability; lead free soldering process; mechanical reliability; printability; reflow results; thermal cycling test; wettability; Bismuth; Consumer electronics; Environmentally friendly manufacturing techniques; Lead; Manufacturing processes; Pulp manufacturing; Soldering; Telephone sets; Testing; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Proceedings. International Symposium on

ISSN

1550-5723

Print_ISBN

0-7803-9085-7

Electronic_ISBN

1550-5723

Type

conf

DOI

10.1109/ISAPM.2005.1432056

Filename

1432056