• DocumentCode
    3220243
  • Title

    Environmentally benign materials for electronics: a review of current developments and emerging technologies

  • Author

    Lincoln, John D. ; Ogunseitan, Oladele A. ; Saphores, Jean-Daniel M. ; Schoenung, Julie M. ; Nixon, Hilary ; Shapiro, Andrew A.

  • Author_Institution
    Dept. of Chem. Eng. & Mater. Sci., California Univ., Irvine, CA, USA
  • fYear
    2005
  • fDate
    16-18 March 2005
  • Firstpage
    139
  • Lastpage
    143
  • Abstract
    Materials used in handheld consumer electronic devices (CEDs), such as cell phones or personal digital assistants, create environmental risks both during procurement and disposal. The increasing global demand for CEDs and recent legislative pressure motivate our review of alternative materials that could make CEDs more environmentally friendly. Hazardous materials considered include brominated flame retardants, lead-based solders, hexavalent chromium, and copper. We survey recent research in the development of environmentally benign replacement materials, provide a brief assessment of the potential environmental, industrial, and economic consequences of their substitution, and assess progress in their industrial application. Identifying appropriate environmentally benign replacement materials provides a starting point for developing environmentally friendly CED prototypes.
  • Keywords
    cellular radio; consumer electronics; design for environment; electronics packaging; environmental factors; hazardous materials; notebook computers; brominated flame retardants; cell phones; consumer electronic devices; copper; disposal; economic consequences; electronics; environmental consequences; environmentally benign replacement materials; hazardous materials; hexavalent chromium; industrial consequences; lead-based solders; personal digital assistants; procurement; Cellular phones; Chromium; Consumer electronics; Copper; Flame retardants; Hazardous materials; Industrial economics; Lead; Personal digital assistants; Procurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Proceedings. International Symposium on
  • ISSN
    1550-5723
  • Print_ISBN
    0-7803-9085-7
  • Electronic_ISBN
    1550-5723
  • Type

    conf

  • DOI
    10.1109/ISAPM.2005.1432064
  • Filename
    1432064