Multiphysics Simulation of Electromagnetic Shielding and Thermal Stressing within Ceramic and Silicon Multilayer Packages for RF Applications

Author

Ding, Jian ; Linton, David ; Armstrong, Mervyn ; Mitchell, Neil ; Fusco, Vince

Author_Institution

The Inst. of Electron., Commun. & Inf. Technol., Queen´´s Univ. Belfast

Volume

1

fYear

2006

fDate

5-7 Sept. 2006

Firstpage

679

Lastpage

683

Abstract

A multiphysics finite element method (FEM) based software, COMSOLtrade has been used to simulate coupled electromagnetic shielding and thermal stress issues for system-in-package (SiP) modules. The ceramic and silicon carriers under study have embedded shielding ground planes. Power HEMT RF devices in GaAs technologies are embedded on and within the carrier causing local thermal hotspots. Thermal cooling is performed using thermal vias. The electromagnetic interaction of thermal vias with the embedded ground plane is studied for hole clearance and via size

Keywords

III-V semiconductors; ceramic packaging; cooling; electromagnetic shielding; finite element analysis; gallium arsenide; power HEMT; silicon; system-in-package; thermal stresses; COMSOLtrade; GaAs; Si; ceramic carriers; ceramic multilayer packages; electromagnetic interaction; electromagnetic shielding; embedded shielding ground planes; finite element method; multiphysics simulation; power HEMT; radiofrequency applications; radiofrequency devices; silicon carriers; silicon multilayer packages; system-in-package modules; thermal cooling; thermal stressing; Application software; Ceramics; Electromagnetic coupling; Electromagnetic shielding; Finite element methods; Nonhomogeneous media; Packaging; Radio frequency; Silicon; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Systemintegration Technology Conference, 2006. 1st

Conference_Location

Dresden

Print_ISBN

1-4244-0552-1

Electronic_ISBN

1-4244-0553-x

Type

conf

DOI

10.1109/ESTC.2006.280079

Filename

4060803