Full Wave Analysis and Electrical Modeling of Eight Copper Interconnects Placed in a Giga-Scale Integrated Environment for Signal Integrity Evaluation

Author

Ponchel, F. ; Legier, J.F. ; Paleczny, E. ; Seguinot, C. ; Deschacht, D.

Author_Institution

IEMN, UMR CNRS

Volume

2

fYear

2006

fDate

5-7 Sept. 2006

Firstpage

747

Lastpage

752

Abstract

Signal integrity analysis on eight unintentionally coupled copper interconnects is derived from an equivalent distributed electrical multi-conductor cell. Compatible with SPICE environment, this elementary cell is calculated with a full wave analysis such as tangential vector finite element method and the transmission line theory. After R, L, C, G and mutual extraction, two types of excitation are implemented based on one aggressor and seven victims and vice versa in order to weigh the influence of parasitic mutual via crosstalk evaluation

Keywords

SPICE; copper; crosstalk; equivalent circuits; finite element analysis; integrated circuit interconnections; integrated circuit modelling; multiconductor transmission lines; transmission line theory; SPICE; copper interconnects; crosstalk evaluation; electrical modeling; equivalent distributed electrical multiconductor cell; full wave analysis; signal integrity analysis; tangential vector finite element method; transmission line theory; Clocks; Copper; Couplings; Crosstalk; Integrated circuit interconnections; Mathematical model; Propagation delay; Signal analysis; Transmission line theory; Ultra large scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Systemintegration Technology Conference, 2006. 1st

Conference_Location

Dresden

Print_ISBN

1-4244-0552-1

Electronic_ISBN

1-4244-0553-x

Type

conf

DOI

10.1109/ESTC.2006.280095

Filename

4060820