DocumentCode
3221899
Title
Viscoelastic Characterization of Polymer Matrix of Thermally Conductive Adhesives
Author
Falat, Tomasz ; Felba, Jan ; Wymyslowski, A. ; Jansen, K.M.B. ; Nakka, John S.
Author_Institution
Fac. of Microsystem Electron. & Photonics, Wroclaw Univ. of Technol.
Volume
2
fYear
2006
fDate
5-7 Sept. 2006
Firstpage
773
Lastpage
781
Abstract
The current paper focuses on the viscoelastic behavior of two different epoxy resins which are commonly used as a matrix for thermally conductive adhesives. The paper deals with the characterization of the viscoelastic properties as well as the reaction kinetics and cure shrinkage. Simulation of contact stresses between silver filler particles then showed a large difference in stress relaxation between the two epoxy matrix materials
Keywords
conductive adhesives; polymers; reaction kinetics; stress relaxation; viscoelasticity; contact stresses; cure shrinkage; epoxy matrix materials; epoxy resins; polymer matrix; reaction kinetics; silver filler particles; stress relaxation; thermally conductive adhesives; viscoelastic characterization; Conducting materials; Conductive adhesives; Elasticity; Epoxy resins; Kinetic theory; Polymers; Silver; Thermal conductivity; Thermal stresses; Viscosity;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Systemintegration Technology Conference, 2006. 1st
Conference_Location
Dresden
Print_ISBN
1-4244-0552-1
Electronic_ISBN
1-4244-0553-x
Type
conf
DOI
10.1109/ESTC.2006.280099
Filename
4060824
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