DocumentCode
3222687
Title
Creep-Fatigue Life of Sn-8Zn-3Bi Solder Under Multiaxial Loading
Author
Itoh, Takayuki ; Yamamoto, Takaei ; Sakane, Masao ; Tsukada, Yutaka
Author_Institution
Dept. of Mech. Eng., Fukui Univ.
Volume
2
fYear
2006
fDate
5-7 Sept. 2006
Firstpage
1012
Lastpage
1019
Abstract
This paper describes the creep-fatigue life of Sn-8Zn-3Bi solder under multiaxial loading. Push-pull and reversed torsion loading tests were carried out using 5 types of strain waveforms, i.e., fast-fast, fast-slow, slow-fast, slow-slow and hold-time waveforms. The effects of strain waveform and strain multiaxiality on the creep-fatigue life were discussed. Strain waveform had a significant effect on creep-fatigue life under multiaxial loading. In the push-pull test, the smallest creep-fatigue life was observed in slow-fast strain waveform. A similar waveform effect was found in the reversed torsion test, but creep-fatigue lives in the reversed torsion tests were longer twice than those in the push-pull tests at the same strain waveform. Conventional creep-fatigue damage models were applied to the experimental data for predicting creep-fatigue lives under multiaxial loading. Only the grain boundary sliding model predicted the multiaxial creep-fatigue life within a small scatter
Keywords
bismuth alloys; creep testing; fatigue testing; solders; tin alloys; torsion; zinc alloys; SnZnBi; creep-fatigue damage models; creep-fatigue life; grain boundary sliding model; multiaxial loading; push-pull tests; reversed torsion loading tests; solder; strain multiaxiality; strain waveform; Capacitive sensors; Electronic equipment testing; Environmentally friendly manufacturing techniques; Fatigue; Lead; Mechanical engineering; Microstructure; Solids; System testing; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Systemintegration Technology Conference, 2006. 1st
Conference_Location
Dresden
Print_ISBN
1-4244-0552-1
Electronic_ISBN
1-4244-0553-x
Type
conf
DOI
10.1109/ESTC.2006.280135
Filename
4060860
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