A room temperature flip-chip mounting technique for laser diodes on silicon motherboards

Author

Vanwassenhove, Luc ; Van Daele, Peter

Author_Institution

Dept. of Inf. Technol., Ghent Univ., Belgium

Volume

2

fYear

1995

fDate

30 Oct-2 Nov 1995

Firstpage

127

Abstract

In this presentation, a relatively simple mounting method is suggested for flip-chip mounting of arrays of edge-emitting laser diodes to arrays of fibers. What really makes the difference with known methods is the use of a room temperature mounting process using a transparent UV-curing, non conducting glue for the fixation of arrays of laser diodes. Apart from power budget problems, the only problem to be solved was the influence of the glue on the laser facets. This has been solved by the application of coatings

Keywords

flip-chip devices; integrated optoelectronics; optical communication equipment; optical fabrication; optical films; semiconductor device packaging; semiconductor laser arrays; semiconductor technology; coatings; edge-emitting laser diodes; fiber array coupling; laser diodes; mounting method; non conducting glue; power budget problems; room temperature flip-chip mounting technique; room temperature mounting process; silicon motherboards; transparent UV-curing; Coatings; Curing; Diode lasers; Gold; Optical arrays; Optical fiber devices; Semiconductor laser arrays; Silicon; Surface emitting lasers; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Lasers and Electro-Optics Society Annual Meeting, 1995. 8th Annual Meeting Conference Proceedings, Volume 1., IEEE

Conference_Location

San Francisco, CA

Print_ISBN

0-7803-2450-1

Type

conf

DOI

10.1109/LEOS.1995.484629

Filename

484629