• DocumentCode
    3230012
  • Title

    Evaluation of sensitive materials for integrated thermal flow sensors

  • Author

    Sabaté, Neus ; Cerdà, Judith ; Gràcia, Isabel ; Berganzo, Javier ; Cané, Carles ; Morante, J.R.

  • Author_Institution
    Centre Nacional de Microelectron., CSIC, Barcelona, Spain
  • Volume
    4
  • fYear
    2002
  • fDate
    5-8 Nov. 2002
  • Firstpage
    2681
  • Abstract
    Calorimetric flow sensors are based on a differential temperature measurement that can be performed between two sensing resistors placed at both sides of a central heating element. Typically, these elements are deposited over a thin dielectric membrane for achieving good thermal isolation. Besides the dependence of the sensor response on factors such as the chip and capsule geometry, flow regime and thermal isolation of the sensor structure, the TCR coefficient of the sensing resistors material has also a relevant influence. In this paper, we focus on the evaluation of three different sensing materials: platinum, nickel and polysilicon. Aspects like sensitivity, electrical stability and fabrication technology compatibility are analysed and their advantages and drawbacks are discussed in view of its implementation in a low cost and high yield industrial process.
  • Keywords
    aluminium; calorimeters; flow measurement; flowmeters; membranes; platinum; silicon; calorimetric flow sensors; capsule geometry; central heating element; chip geometry; electrical stability; fabrication technology compatibility; flow regime; industrial process; integrated thermal flow sensors; nickel; platinum; polysilicon; sensing resistors material; sensitive materials evaluation; sensitivity; sensor response; sensor structure; thermal isolation; thin dielectric membrane; Biomembranes; Dielectric materials; Geometry; Heating; Performance evaluation; Resistors; Temperature measurement; Temperature sensors; Thermal factors; Thermal sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    IECON 02 [Industrial Electronics Society, IEEE 2002 28th Annual Conference of the]
  • Print_ISBN
    0-7803-7474-6
  • Type

    conf

  • DOI
    10.1109/IECON.2002.1182817
  • Filename
    1182817