• DocumentCode
    3231635
  • Title

    Estimation-based run-time power profile flattening for RF-powered smart card systems

  • Author

    Genser, Andreas ; Bachmann, Christian ; Steger, Christian ; Weiss, Reinhold ; Haid, Josef

  • Author_Institution
    Inst. for Tech. Inf., Graz Univ. of Technol., Graz, Austria
  • fYear
    2010
  • fDate
    6-9 Dec. 2010
  • Firstpage
    1187
  • Lastpage
    1190
  • Abstract
    Power-constrained systems, such as RF-powered smart cards are gaining increased significance in the embedded system´s domain. These systems are highly susceptible to supply voltage drops caused by power peak regions that impact on the system stability. Power profile flattening mechanisms have emerged as an effective power peak countermeasure to enhance system reliability. In this paper we present a hardware power profile flattening approach by employing system-level DVFS adaptions coupled with a hardware power estimation architecture. The exploitation of hardware-accelerated real-time power estimation techniques replaces costly analog on-chip power measurements and enables the dynamic control of the system´s power consumption in a purely digital manner. We demonstrate the effectiveness of our approach by conducting power profiling and voltage drop analysis of a deep-submicron RF-powered smart card system.
  • Keywords
    analogue integrated circuits; embedded systems; power consumption; power measurement; reliability; smart cards; RF-powered smart card systems; analog on-chip power measurements; dynamic control; embedded system domain; estimation-based run-time power profile flattening; hardware power estimation; hardware power profile flattening; hardware-accelerated real-time power estimation; power consumption; power peak countermeasure; power-constrained systems; system reliability; system-level DVFS adaptions; Computer architecture; Coprocessors; Estimation; Hardware; Power demand; Smart cards; Software;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems (APCCAS), 2010 IEEE Asia Pacific Conference on
  • Conference_Location
    Kuala Lumpur
  • Print_ISBN
    978-1-4244-7454-7
  • Type

    conf

  • DOI
    10.1109/APCCAS.2010.5775006
  • Filename
    5775006