• DocumentCode
    3231714
  • Title

    Identifying capacity loss due to operational work methods

  • Author

    Connerney, Karen

  • Author_Institution
    Microelectron. Div., IBM Corp., Essex Junction, VT, USA
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    156
  • Lastpage
    160
  • Abstract
    A new semiconductor manufacturing line costs in excess of Θ to build and equip. Because of these high costs, it is imperative that all components of capacity loss be identified and understood. Traditionally, much emphasis has been placed on understanding the contribution of tool non-availability to capacity loss. There has been considerable attention paid by engineering and maintenance to identifying and improving these loss components. However, significant capacity loss can also occur when a production operator is not available to attend a tool in a timely fashion to load and unload lots. This paper discusses an analysis that identifies and quantifies the capacity loss caused by operator unavailability for a specific tool set, i.e., CVD tungsten and HDP deposition tools. A multiobservational study was used as the specific technique to examine the performance of the tool set. The analysis included an examination of operator head count, activity, and coverage. The study showed a significant loss because of operator non-availability and identified specific work methods that contributed to this loss. The results were then used to suggest modifications to these work methods to reduce the amount of capacity lost
  • Keywords
    human resource management; personnel; semiconductor device manufacture; time management; capacity loss; cross training; deposition tools; operational work methods; operator activity; operator coverage; operator head count; operator unavailability; productivity; sampler observations; semiconductor manufacturing line; specific tool set; tool set performance; wait-for-operator time; Costs; Data analysis; Electronics industry; Manufacturing industries; Microelectronics; Performance loss; Production; Productivity; Semiconductor device manufacture; Tungsten;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference and Workshop, 1999 IEEE/SEMI
  • Conference_Location
    Boston, MA
  • ISSN
    1078-8743
  • Print_ISBN
    0-7803-5217-3
  • Type

    conf

  • DOI
    10.1109/ASMC.1999.798210
  • Filename
    798210